Standard
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AS 4169-2004
[Current]Specifies requirements for electroplated coatings of nominally pure in on fabricated metal articles including tin-coatings on electron components. Adopted with national modifications and reproduced from ISO 2093:1986.
Published: 16/03/2004
Pages: 9
Table of contents
Cited references
Content history
Table of contents
Header
About this publication
Preface
0 Introduction
1 Scope and field of application
2 References
3 Definitions
4 Information to be supplied by the purchaser to the electroplater
4.1 Essential information
4.2 Additional information
5 Basis material
6 Sampling
7 Classification
7.1 Service condition number
7.2 Coating classification code
8 Heat treatment of steel
8.1 Stress relief before electroplating
8.2 Hydrogen embrittlement relief after electroplating
9 Requirements for undercoats
10 Requirements for coatings
10.1 Appearance
10.2 Thickness
10.3 Adhesion
10.4 Porosity
10.5 Solderability (see clause A.2)
10.5.1 General materials and piece parts
10.5.2 Printed circuit boards
Annex A
A.0 Introductory notes
A.0.1 Routine methods
A.0.2 Referee methods
A.0.2.1 General
A.0.2.2 Local thickness greater than 9 μm
A.0.2.3 Local thickness less than 9 μm
A.0.2.4 Average thickness of tin on copper, nickel or steel
A.0.2.5 Average thickness of undercoat and of tin on undercoats on basis material such as aluminium
A.0.2.6 Thickness of tin in electroplated-through holes of circuit boards
A.1 Measurement of local thickness
A.1.1 Microscopical method
A.1.2 Coulometric method
A.1.3 Beta backscatter method
A.1.4 X-ray spectrometric method
A.2 Measurement of average thickness
A.2.1 Principle
A.2.2 Reagents
A.2.2.1 For stripping from iron basis materials and nickel undercoats
A.2.2.2 For stripping from copper and copper alloys
A.2.3 Test specimen
A.2.4 Procedure
A.2.4.1 For iron basis materials and nickel undercoats on copper and copper alloys
A.2.4.2 For copper and copper alloys
A.2.5 Expression of results
Annex B
B.1 Burnishing test
B.2 Bend test
B.3 Thermal shock test
Annex C
C.1 Properties of the coating
C.1.1 General
C.1.2 Whisker growth
C.1.3 Allotropic changes
C.2 Properties and preparation of the basis material
C.2.1 Surface condition
C.2.2 Formation of intermetallic compounds
C.2.3 Diffusion of zinc
C.2.4 "Difficult" basis materials
C.2.5 Aluminium, magnesium and zinc alloys
C.3 Electroplating practice
C.3.1 Post-electroplating rinse
C.3.2 Coating thickness requirements
C.3.3 Co-deposition of organic matter
C.4 Flow-melting
C.5 Tin coatings in contact with food
C.5.1 Organic brighteners
C.5.2 Tin content
Appendix ZZ
ZZ1 Explanation
ZZ2 Variations
Cited references in this standard
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