Standard
Track updates
AS 30129:2018
[Current]Information technology — Telecommunications bonding networks for buildings and other structures
The objective of this Standard is to specify the requirements and recommendations for the design and installation of connections (bonds) between various electrically conductive elements in buildings and other structures, during their construction or refurbishment, in which information technology (IT) and, more generally, telecommunications equipment is intended to be installed in order to - (a) minimize the risk to the correct function of that equipment and interconnecting cabling to the electrical earth system; and (b) provide the telecommunications installation with a reliable signal reference, which may improve immunity from electromagnetic interference (EMI).
Published: 23/10/2018
Pages: 40
Table of contents
Cited references
Content history
Table of contents
Header
About this publication
Preface
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviations
3.1 Terms and definitions
3.2 Abbreviations
4 Conformance
5 Overview of bonding networks
6 Selection of the telecommunications bonding network approach
6.1 Assessment of the impact of the telecommunications bonding network on the interconnection of telecommunications equipment
6.2 Telecommunications bonding networks
6.3 Telecommunications bonding network performance
6.3.1 General
6.3.1.1 Protective bonding networks
6.3.1.2 Dedicated telecommunications bonding networks
6.3.2 Requirements
6.3.2.1 General requirements
6.3.2.2 Protective bonding networks
6.3.2.3 Dedicated bonding networks
6.3.3 DC resistance measurements
6.3.3.1 General
6.3.3.2 Dedicated bonding networks
7 Common features
7.1 General
7.2 Protective bonding networks
7.2.1 Protective bonding network conductors (PBNCs)
7.2.2 Main earthing terminal (MET)
7.3 Telecommunications entrance facility (TEF)
7.4 Telecommunications bonding network components
7.4.1 Telecommunications bonding network conductors
7.4.1.1 Materials
7.4.1.2 Installation
7.4.2 Telecommunications bonding network connections
7.5 Cabinets, frames and racks
7.5.1 External connections to a bonding network
7.5.1.1 Requirements
7.5.1.2 Recommendations
7.5.2 Rack bonding conductors
7.5.2.1 Rack bonding conductors for d.c. resistance control
7.5.2.2 Rack bonding conductors (RBC) for impedance control
7.5.2.2.1 Requirements
7.5.2.2.2 Recommendations
7.5.3 Internal connections
7.5.3.1 Requirements
7.5.3.2 Structural bonding within cabinets, frames and racks
7.6 Miscellaneous bonding connections
7.6.1 General
7.6.2 Bonding conductors for d.c. resistance control
7.6.3 Bonding conductors for impedance control
7.6.3.1 Requirements
7.6.3.2 Recommendations
7.7 Documentation
8 Dedicated telecommunications bonding network
8.1 General
8.2 Components
8.2.1 Primary bonding busbar (PBB)
8.2.2 Secondary bonding busbar (SBB)
8.2.3 Bonding conductors for d.c. resistance control
8.2.3.1 Telecommunications bonding conductor (TBC)
8.2.3.2 Telecommunications bonding backbone (TBB)
8.2.3.2.1 Requirements
8.2.3.2.2 Recommendations
8.2.3.3 Backbone bonding conductor (BBC)
8.2.4 Bonding conductors for impedance control
8.2.4.1 Telecommunications bonding backbone (TBB)
8.2.4.1.1 Requirements
8.2.4.1.2 Recommendations
8.2.4.2 Backbone bonding conductor (BBC)
8.2.4.2.1 Requirements
8.2.4.2.2 Recommendations
8.3 Implementation
8.3.1 Primary bonding busbar (PBB)
8.3.1.1 General
8.3.1.2 Bonding to the PBB
8.3.2 Secondary bonding busbar (SBB)
8.3.2.1 General
8.3.2.2 Bonding to the secondary bonding busbar
8.3.3 Telecommunications bonding conductor (TBC)
8.3.4 Telecommunications bonding backbone (TBB)
8.3.5 Backbone bonding conductor (BBC)
8.3.6 Bonds to continuous conductive pathway systems
8.3.7 Bonds to structural metal
9 Local telecommunications bonding networks in conjunction with protective bonding networks
9.1 Bonding for local distribution
9.1.1 Star protective bonding networks
9.1.2 Ring protective bonding networks
9.2 Telecommunications bonding conductors
9.2.1 Bonding conductors for d.c. resistance control
9.2.1.1 Requirements
9.2.1.2 Recommendations
9.2.2 Bonding conductors for impedance control
9.2.2.1 Requirements
9.2.2.2 Recommendations
9.3 Bonding for areas of telecommunications equipment concentration
10 Local telecommunications bonding networks in conjunction with dedicated telecommunications bonding networks
10.1 Bonding for areas of telecommunications equipment concentration
10.1.1 Requirements
10.1.2 Recommendations
10.1.3 Cabinets, frames and racks
10.2 Telecommunications equipment bonding conductors (TEBC)
10.2.1 TEBC for d.c. resistance control
10.2.2 TEBC for impedance control
10.2.2.1 Requirements
10.2.2.2 Recommendations
10.2.3 Implementation
11 Mesh bonded networks
11.1 General
11.2 Mesh bonding alternatives
11.2.1 Local mesh bonding (MESH-IBN) networks
11.2.1.1 General
11.2.1.2 Requirements
11.2.1.3 Recommendations
11.2.2 MESH-BN
11.2.2.1 General
11.2.2.2 Requirements
11.3 Bonding conductors of a mesh bonding network
11.3.1 Requirements
11.3.2 Recommendations
11.4 Bonding conductors to the mesh bonding network
11.5 Supplementary bonding grid (SBG)
11.6 System reference potential plane (SRPP)
11.6.1 General
11.6.2 Access floors
11.6.2.1 Requirements
11.6.2.2 Recommendations
11.6.3 Transient suppression plate (TSP)
Annex A
A.1 General
A.2 Periodic activity
A.2.1 Schedule
A.2.2 Implementation
A.2.2.1 Protective bonding network
A.2.2.2 Dedicated bonding network
A.2.2.3 Assessment of results
A.3 Causes of performance deterioration
A.3.1 Galvanic corrosion
A.3.2 Requirements
Annex B
Annex C
Appendix ZZ
ZZ.1 Scope
ZZ.2 Variations
Cited references in this standard
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