Standard
UPDATE AVAILABLE
AS 1099.2EB-1971
[Superseded]Basic environmental testing procedures for electrotechnology, Part 2EB: Tests — Bump
The object of this test is to determine the suitability of components and equipments for
applications where they are subjected to prolonged bumping and/or to assess their structural integrity.
Published: 01/01/1971
Pages: 4
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[Superseded]
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